This technique uses an electrical current and a chemical bath to form a thin, uniform metal coating on a wafer. 🙌

Watch the video to reveal our Word(s) of the Week.

Small design choices can have a big impact on wafer-level results.

We examine how techniques like dummy patterning and layout optimization give engineers greater control over etch behavior. Dive in. bit.ly/4vxhUNL

Scaling chips to 2nm or below is about more than just shrinking features — it reshapes how chips are built and optimized. These changes introduce constraints, requiring teams to adjust across design, process, and integration at the same time. See how. https://bit.ly/47QVhcJ

One wrong move and the SAQP process turns small variations in mandrel and spacer dimensions into big defects.

See how we used Monte Carlo virtual fabrication to evaluate interactions among process variables that influence pitch walk and minimize defects. https://bit.ly/4sAKwCY

Next-gen DRAM moves fast — precision can’t slow it down. Which tool extends single print EUV patterning while cutting cost and complexity?

Watch to reveal the solution accelerating advanced memory. ⬇️

Not all etch or deposition processes follow a straight path. Sometimes, these processes occur equally in every direction.

What term captures this kind of behavior? Watch to find out.

Virtual twins allow engineers to simulate real-world processes without relying on physical testing, accelerating development cycles, reducing resources used, and lowering overall carbon footprint. Learn more. https://bit.ly/423tYZj

The iPhone wasn’t the only breakthrough to emerge in 2007. Take a look back at what we launched that same year to enable next-generation devices.

The road to faster, smarter devices depends on DRAM’s evolution. 🛣️⚙️

From early 2000s breakthroughs to today’s high-speed innovations, the journey continues. Here’s what’s ahead.

Our Word of the Week is a key player in controlling current flow within a transistor — activated by voltage to regulate what gets through. Can you guess what it is?

Dextro™ handles repetitive, time-intensive maintenance tasks, so engineers can focus on what matters most — driving innovation.

Discover how our cobot enables more efficient fabs. https://bit.ly/4sr5Smf

Our deposition and etch tools give manufacturers the precision needed for 3D DRAM memory.

Watch the full video to learn how. https://bit.ly/4s2bJOJ

Velocity = speed + direction. See how Lam is increasing velocity in everything we do to enable the AI era, atom by atom. https://bit.ly/41cuAf0

As MEMS technology advances, the transition to 300mm wafers enables improved performance and new applications. Explore how we are supporting that shift with advanced tools and virtual development approaches. https://bit.ly/3NUeYK2

What if you could see stress before it breaks your chip? 🛠️ SEMulator3D® lets engineers virtually track mechanical stress evolution through each process step — backtracking issues, testing material tweaks, and optimizing designs. Learn more via the blog. https://bit.ly/3ECeCCO

Learn why hybrid bonding is key to enabling 3D integration for next-generation SRAM/processor stacks used in HPC and multi-tiered 3D NAND devices. https://bit.ly/4sLpm5Y

Wondering what makes Sense.i® a top pick in the fab? We have the answer below. https://bit.ly/4dkZcls

What’s small, essential, and always in use? Our Word of the Week! Watch to reveal.

2nm brings new power benefits but also new challenges in thermal behavior and integration. Multi-die assemblies help balance these tradeoffs as the industry looks for more flexible and efficient ways to scale. https://bit.ly/4lrABNS

Lam has been named one of the World’s Most Ethical Companies by Ethisphere™ for the fourth straight year. https://bit.ly/4bBxwX4

Data doesn’t wait — and neither does DRAM.

As data demands increase, we leverage our close-to-customer advantage to deliver precision tools and technologies that accelerate memory innovation, helping new breakthroughs move from development to production faster. https://bit.ly/4kPApYR

High-aspect-ratio holes, multi-layer stacks, and sub-nanometer features push 3D NAND to its limits. Advanced metrology, IRCD, X-ray, and high-energy e-beam make it possible to map, inspect, and optimize every layer. Learn more. https://bit.ly/4sOoBsB

We uncovered a time capsule from 2004! That year, Gmail launched, the industry reached the 90nm technology node, and we introduced the first ALTUS® tungsten barrier CVD system. Take a look inside.

As FinFET devices become more complex, accurate modeling matters. Explore more about how calibrated virtual fabrication helps engineers predict real device profiles more reliably and make better process decisions earlier. https://bit.ly/4lkV9HT

Multiple chips. Different functions. One unified system. Our Word(s) of the Week is a packaging technology that shrinks complexity and amplifies performance, all in a single module. Can you guess what it is?

Materials engineering makes tomorrow’s technologies possible. 🚀

As we enter the era of AI, engineers look to silicon photonics to deliver faster and more efficient computing. Discover how our advanced etch systems, like Kiyo® FX, meet photonics demands. https://bit.ly/4sOz879

As AI drives data center energy use upward, GaN offers a path to better efficiency and higher performance. Moving GaN manufacturing to 300 mm wafers brings improved control, higher capacity, and stronger device performance. https://bit.ly/4b8Zp8I

We turn innovation into impact with atomic-level precision, helping our customers unlock breakthroughs fast. Which tool sculpts ultra-precise etches with atomic-scale control and higher aspect ratios for next-gen devices?

Reply below if you get it right!

Before engineers etch, deposit, or define anything, this step determines the outcome. It quietly shapes everything that follows. Any guesses for this week’s Word of the Week?

Who knew cleaning could shrink your carbon footprint? 🧹

By optimizing the plasma chamber clean in collaboration with STMicroelectronics, we cut NF3 use by a third and reduced CO2e emissions — all without slowing production. https://bit.ly/4kZO66Q