Why? Why not?

Will have some time with four Arc Pro B70 in a Battlematrix workstation.

Testing some Intel Arc Pro B70

VSORA Jotunn8

- 8 compute chiplets
- 8 HBM3E
- TSMC CoWoS-S packaging
- 500 W TDP

The package is just a dummy right now. Production is ramping up right now. We will have to wait until MLPerf Inference v6.1 to see how it compares to the competition.

Not only the GPUs are doing the heavy lifting.

Four extra cores and a little software magic: Intel Core Ultra 5 250K Plus and Core Ultra 7 270K Plus review:

www.hardwareluxx.de/index.php/ar...

This excellent video by Scott Manley explores how the thermal balance of spacecraft works and what it would take to design a spacecraft capable of dissipating the heat generated by space-based data centers.

www.youtube.com/watch?v=FlQY...

Oh, I had a brain lag 🤦‍♂️

I love it when your German just slips out every now and then (“gut”)—it happens to me all the time, too ;)

Imec starts installing of its ASML EXE:5200 High NA EUV system in its 300 mm clean room in Leuven. Qualification should be finished in Q4 2026.

Since I’m currently looking into 200S Boost again for various reasons, I came across this fantastic German translation.

"Die" (Die-2-Die) can be translated to "Stirb" in German which means "death" or "pass away".

So it's a Death-to-Death-Interface.

20 years of CUDA and I was there, when it was born. It was a different NVIDIA, it was a different Jensen ;) #GTC2026 #CUDA

Comparison of the logic boards of the new MacBook Neo with the iPhone 16 Pro which is using the same SoC as well as the MacBook Air with M3.

Source: youtu.be/PbPCGqoBB4Y

Even though DDR prices are not going up anymore, this shows escalation stage 1 and stage 2 when it comes to memory being not affordable anymore.

Intel Heracles, a FHE accelerator build in Intel 3

MTAI 500:
- 4x Compute
- 2x Network
- 1x SoC
- later in 2027

Meta #MTAI Roadmap:

MTAI 300:
- 1x Compute
- 2x Network
- in production

MTAI 400:
- 2x Compute
- 2x Network
- 1x SoC-Chiplet
- path to being deployed

MTAI 450:
- 2x Compute
- 2x Network
- 1x SoC
- faster D2D compared to MTAI 400
- early 2027

Core Ultra 7 270K Plus vs Core Ultra 7 265K
Core Ultra 5 250K Plus vs Core Ultra 5 245K

But be careful: Plus SKUs did use DDR5-7200 while the non refresh SKUs did use DDR5-6400. It's legit in terms of MC verification, but keep it in mind when seeing these numbers.

Samples already arrived.

Intel just announced the Core Ultra 200S Plus SKUs.

Two additional efficiency cores and +900 MHz for the D2D interface.

www.hardwareluxx.de/index.php/ne...

Today I saw my first meteorite burn up in the atmosphere. What a spectacle!

Something to play around with in the coming days.

If I'm not doing a mistake, with 3 $/G it's "just" 25 % cheaper compared to Germany. I did expect the difference to be much bigger.

Fortunately, we switched to a heat pump for heating and hot water in November last year and also cover a large part of our electricity needs with a solar power system.

These are tools, that should not really exist, but for certain reasons, in some cases there is at least a desire to use them.

We had a look at the Aqua Computer Ampinel and Thermal Grizzly WireView Pro II – do show the features and limitations:

www.hardwareluxx.de/index.php/ar...

So we now have the Compute Tile (Intel 18A, first wafer) and Base Tile (Intel 3, second wafer), but we are still missing the I/O Tile (Intel 7) for Clearwater Forest.

#Ampinel by #AquaComputer working hard to balance a faulty 12V-2x6 cable at 600 watts. You can see how the MOSFETs of the balancing electronics are increasing the electrical resistance to regulate inequalities to a certain degree.

What we have seen before:

Intel just released some new wafer shots of Xeon 6+ aka Clearwater Forest with a different esthetic compared to what we have seen before. Thats presumably because more metal layers are present to this one?

AMD PR gave the answer a little later. There are also non-PRO SKUs.

Ryzen AI PRO 400 is not only limited to the PRO segment with regard to the target group, but also in terms of the number of CPU cores and CUs.

But there are still renderings without the "PRO" naming floating around with this announcement. So there is still hope for a 8000G successor.

Like Samsung with Fab P5, SK Hynix is also planing a three story cleanroom structural framing that fits up to six cleanrooms in one building of the Yongin semiconductor cluster. Opening of the first cleanroom is expected to be moved up from May to February 2027.

news.skhynix.com/new-facility...