Performance of epoxy hexagonal boron nitrate underfill materials: Single and mixed systems The thermal mismatch between silicon chips, solder bumps, and substrates in electronic packaging raises reliability concerns, including solder joint failures and warping. To mitigate these issues,…

#EpoxyComposites with h-BN fillers exhibit size- and volume-dependent properties: 70 nm fillers at 5 vol% achieve highest flexural strength, while a 25:75 mix of 70 nm/5 µm fillers provides optimal #ThermalStability and toughness.

#OpenAccess in e-Polymers: