#Extoll

The Backbone of a Compute Network: An Interconnect for Processing Units The HIGHER project is developing three Host Processor Modules (HPMs). Two of these integrate the Rhea2 processor and the third incorporates the EU Pilot

Connecting next-gen processors into powerful, scalable compute clusters? Our latest article by #Extoll explores the interconnect tech powering the HIGHER Project, from advanced Network-on-Chip design to seamless chip-to-chip communication. Learn more here 👉 tinyurl.com/3mwtaca2