Performance of epoxy hexagonal boron nitrate underfill materials: Single and mixed systems

Optimizing the synergy between nano- & micron-sized #HexagonalBoronNitride fillers within epoxy composites enhances #ThermalConductivity, flexural strength & fracture toughness, providing a robust solution for electronic packaging.

e-Polymers #OpenAccess: doi.org/10.1515/epol...