Conformal ultra-thin, ultra-uniform metal films fabricated on non-planar substrates for advanced optoelectronics
Presenting a conformal deposition model with a metal co-doping method for #Fabrication of ultra-thin, conformal metal films on non-planar surfaces, optimizing seed-layer thickness to achieve superior #Optoelectronic performance. #ElectronicMaterials
#OpenAccess: doi.org/10.1088/2631...