Beating The Heat In 3D Packages Thermal management is the biggest performance and reliability bottleneck in multi-die assemblies.

Semiconductor Engineering's latest special report out today semiengineering.com/beating-the-...

#semiconductor #thermalmanagement #3DIC #warpage #CTE #STCO #thermalmodeling

Open Dataset for Machine Learning in Machine Tool Thermal Modeling

An open dataset captures thermal behavior of a vertical‑axis machine‑tool test rig, with temperature and heat‑flux data from 29 probes each second over 1,800 steps (30 min) in 17 runs. Read more: getnews.me/open-dataset-for-machine... #machinetool #thermalmodeling