This study shows #laser‑induced #Thermocompression bonding uses scattering forces to suppress #SurfaceTension shrinkage in Cu #nanowires, enlarging the Cu–Au interface fourfold and cutting resistance ~56% for #nanoscale device integration.

#OpenAccess in #IJEM: doi.org/10.1088/2631...

✨Laser-induced thermo-compression bonding flattens #Cu #nanowires (~200 nm), quadrupling the Cu–Au interface and cutting contact resistance by ~56%.

✨Open Access #IJEM👇:
doi.org/10.1088/2631...

#ExtremeManufacturing #NanoTechnology #CuAuInterconnects #LaserBonding #NANO #laser #thermoCompression