Chip Industry Week In Review Tighter restrictions on DUV litho; Arm-IBM dual-architecture deal; power device trio; Intel takes full control of Irish fab; 1.4nm AI chip; data center heat islands; 300mm fab equipment spending; 67k ...

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Are Larger Reticle Sizes On The Horizon? The stitching process for 1nm litho faces yield challenges with high-NA EUV.

Making high-NA EUV lithography work will take a manufacturing-worthy approach to stitching together circuits or a wholesale change to larger masks.
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