HexaTech Introduces Groundbreaking 3-Inch Aluminum Nitride Substrate for High-Volume Production HexaTech, Inc. has launched a new 3-inch diameter aluminum nitride substrate, pushing the boundaries of high-performance electronic devices for commercial production.

HexaTech Introduces Groundbreaking 3-Inch Aluminum Nitride Substrate for High-Volume Production #United_States #Morrisville #HexaTech #Aluminum_Nitride #Substrate

The Semiconductor Ceramic Packaging Materials Market Projected to Reach $2.78 Billion by 2030 The demand for semiconductor ceramic packaging materials is anticipated to soar, reaching $2.78 billion by 2030, driven by technological advancements.

The Semiconductor Ceramic Packaging Materials Market Projected to Reach $2.78 Billion by 2030 #United_States #Delray_Beach #Semiconductor_Market #Aluminum_Nitride #Ceramic_Packaging

HexaTech Introduces Advanced N-polar Aluminum Nitride Substrate for Power Device Innovations HexaTech has announced the commercial launch of an optimized nitrogen face aluminum nitride substrate, enhancing power and RF device development capabilities.

HexaTech Introduces Advanced N-polar Aluminum Nitride Substrate for Power Device Innovations #United_States #Morrisville #HexaTech #Aluminum_Nitride #N-polar