#OCPSummit25: UALink for Scale-Up AI Interconnects Check out full showcase at: https://ngi.fyi/ocpsummit25yt to get the attendee and sponsor perspectives from the show floor of the #OCPGlobalSummit 2025 UALink Consortium Chairman Kurtis Bowman discusses the consortium's collaboration with the Open Compute Project and reveals key technical advantages of the UALink interconnect technology. Bowman outlines how UALink delivers superior performance through lower power consumption, reduced latency, and enhanced bandwidth efficiency compared to existing solutions. He provides insights into the growing member ecosystem and shares the consortium's roadmap for market deployment, while explaining the strategic philosophy behind open standards in accelerator interconnect technology. **What You Will Learn:** - How UALink's technical architecture achieves lower power and latency than competing solutions - The bandwidth efficiency advantages that enable near-theoretical data transfer rates - Timeline for UALink adoption across data centers and member product availability - Why consortium collaboration with organizations like OCP drives industry innovation - AMD's competitive strategy around open standards versus proprietary approaches - The role of openness in fostering multi-vendor innovation and market advancement 📚 CHAPTERS: 0:00:00 - Introduction and OCP Partnership 0:00:24 - UALink Technical Advantages and Performance Benefits 0:01:19 - Bandwidth Efficiency and Real-Time Applications 0:01:33 - Member Ecosystem and Market Timeline 0:01:58 - The Philosophy of Openness in Technology Standards 0:02:21 - AMD's Innovation Strategy and Competitive Approach Want to be involved our video series? Contact info@nextgeninfra.io

Watch the #UALinkConsortium interview with Next Gen Infrastructure during #OCPSummit2025 to explore the advantages of an open ecosystem and how UALink is meeting the escalating computing demands of AI applications: bit.ly/47BsLfr

Unleashing AI Scale Up UALink and OCP Collaboration Kurtis Bowman Director, Architecture and Strategy - AMD    The rapid proliferation of AI and HPC workloads demands unprecedented levels of interconnect performance, scalability, and efficiency within data centers. Proprietary solutions have historically limited choice and driven up costs. The UALink Consortium, formed by leading industry players, is tackling this challenge head-on by developing an open industry standard for high-performance accelerator-to-accelerator communication. This session will delve into the newly released UALink 1.0 Specification, highlighting its architectural innovations designed for low-latency, high-bandwidth communication among hundreds to thousands of AI accelerators within a single pod. We will discuss how UALink enables simple load, store, and atomic operations with software coherency, crucial for maximizing AI model training and inference efficiency. We will detail the strategic collaboration between the UALink Consortium and the Open Compute Project (OCP) Foundation.

Watch the “Unleashing AI Scale Up UALink and OCP Collaboration” presentation from #OCPSummit2025 for a deep dive into the #UALink 1.0 specification and how it enables simple load, store, and atomic operations to maximize AI model training and inference efficiency: bit.ly/4762Nk2

Applications and Use Cases for UALink Enabling Efficient, Open Networking for AI Scale-Up Systems Rohit Mittal Head of AI Products and Technologies - UpscaleAI, Chris Petersen Fellow of Technology and Solution Architecture - Astera Labs, Josh Collier Engineer - Intel, Priyank Shukla Director of Product Management - Synopsys   As AI compute demands continue to rise, Cloud Service Providers, System OEMs, and IP-Silicon Providers require a high-performance, efficient solution to meet the challenges of scale-up AI infrastructure. The UALink Specification delivers a low-latency, high-bandwidth interconnect designed to enable fast, efficient communication between accelerators and switches within AI computing pods, boosting performance while improving power and cost efficiency.  In this panel, UALink experts will explore real-world applications and use cases for the technology, highlighting how UALink supports the development of next-generation AI-ML scale-up systems. The discussion will also cover the importance of supply chain diversity and system interoperability enabled by UALink. Attendees will gain insight into the specification roadmap and upcoming enhancements to UALink technology.

During #OCPSummit2025, #UALinkConsortium experts discussed the applications and use cases of #UALink technology. Watch the panel to learn how UALink is enabling the next-generation of AI/ML scale-up systems: bit.ly/3LbkBS9

If you’re attending the #OCPSummit2025, join the #UALinkConsortium sessions to learn how #UALink, an open standard for AI scale-up networking, can unlock scalable, efficient, and interoperable AI infrastructure. Learn more: bit.ly/3WvgqD6

Participate in the “Unleashing AI Scale-Up: UALink and OCP Collaboration” session at #OCPSummit2025 to learn how #UALink enables simple load, store, and atomic operations to meet the escalating demands of #AI applications. Learn more: bit.ly/3KAxHIs