Defect-free Co/SiO₂ #HybridBonding achieved via Ar/NH₃/H₂O #PlasmaActivation enhances #SurfaceEnergy and reduces Co–Co interface resistance by >40%, enabling oxide-free bonding for #UltraHighDensity integration with broad material compatibility.

#IJEM: doi.org/10.1088/2631...

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