3D Semiconductor Packaging Market Report Size, Share & Trend 2035 3D Semiconductor Packaging Market is expected to reach USD 60.47 Billion at a CAGR of 14.09% by 2035, Global 3D Semiconductor Packaging Industry Growth Analysis by types, packaging methods, end-users.

3D Semiconductor Packaging Market Report Size, Share & Trend 2035 www.marketresearchfuture.com/reports/3d-s...
#3DPackaging #Chiplets #AIChips #Semiconductor #AdvancedPackaging #HighPerformance #NextGenGaming #Innovation #Tech

3月4日(水)13:10-17:00に、エレクトロニクス実装学会 #JIEP 信頼性解析技術委員会が公開研究会『高密度実装デバイスの信頼性解析技術と課題（案）〜チップレット・3D積層等がもたらす新たな故障モードと評価技術〜』を開催。講演5件。東京都杉並区・回路会館およびオンラインにて。詳細は buff.ly/CP3kz4h に。
#Seminar #Reliability #3DPackaging