DecaがIBMと提携し、北米で先進的な半導体技術を展開 Deca TechnologiesとIBMが提携し、ブロモント工場に新たなパッケージング技術を導入。高密度通信を実現し、次世代半導体の生産を加速します。

DecaがIBMと提携し、北米で先進的な半導体技術を展開 #IBM #半導体技術 #Deca_Technologies

Deca TechnologiesとIBMが提携し、ブロモント工場に新たなパッケージング技術を導入。高密度通信を実現し、次世代半導体の生産を加速します。

YES RapidCure Systems Chosen by SkyWater for Advanced Wafer-Level Packaging Yield Engineering Systems, Inc. has been selected by SkyWater Technology to implement RapidCure systems for cutting-edge wafer-level packaging.

YES RapidCure Systems Chosen by SkyWater for Advanced Wafer-Level Packaging #USA #Fremont #SkyWater #YES_RapidCure #Deca_Technologies

YES RapidCure System Chosen by SkyWater Technology for Innovative Semiconductor Packaging SkyWater Technology has chosen YES RapidCure Systems to enhance their semiconductor packaging processes, leveraging advanced technology.

YES RapidCure System Chosen by SkyWater Technology for Innovative Semiconductor Packaging #USA #Fremont #SkyWater_Technology #YES_RapidCure #Deca_Technologies