Improving bending fatigue lifetime and interfacial adhesion of Cu–Mn flexible interconnects using self-forming nanolayer

Cu–Mn alloy interconnects with a self-forming #MnOx #nanolayer suppress extrusions and boost #MetalPolymer adhesion, preventing fatigue cracks and delamination to enhance reliability and lifetime of #flexibleelectronic interconnects.
Nanotechnology Reviews: doi.org/10.1515/ntre...