Making Hybrid Bonding Better Why this technology is so essential for multi-die assemblies, and how it can be improved.

The future of semiconductor manufacturing is no longer dependent just on shrinking features. Instead, chipmakers are rethinking how devices are built, stacked, and powered.
semiengineering.com/making-hybri...

#semiconductor #hybridbonding

2月3日(火)13:00-17:25に、エレクトロニクス実装学会 #JIEP 最先端めっき実装研究会が2025年度第2回公開研究会「先端半導体パッケージとCu-Cu直接接合 -ハイブリッドボンディングおよびその周辺技術の最前線- 」を開催。講演5件。大阪市浪速区・大阪府立大学I-siteなんばおよびオンラインにて。詳細は buff.ly/agPNQ2D に。
#Seminar #AdvancedPackaging #HybridBonding

Defect-free Co/SiO₂ #HybridBonding achieved via Ar/NH₃/H₂O #PlasmaActivation enhances #SurfaceEnergy and reduces Co–Co interface resistance by >40%, enabling oxide-free bonding for #UltraHighDensity integration with broad material compatibility.

#IJEM: doi.org/10.1088/2631...

Challenges In Stacking HBM What changes are needed to stack 24 layers of high-bandwidth memory.

Challenges In Stacking HBM:
What changes are needed to stack 24 layers of high-bandwidth memory.
semiengineering.com/challenges-i...

#HBM #hybridbonding #warpage #metrology #datacenter

KISTEC｜(地独)神奈川県立産業技術総合研究所 爆発的に拡大するAI需要を背景に、半導体にはデータ処理の高効率化と省エネルギー化がこれまで以上に強く求められています。こうした課題のブレークスルー技術として、近年「チップレット」が大きな注目を集めています。特に、超高密度配線を実現する「ハイブリッド接合」は、次世代AIアーキテクチャに不可欠なキーテクノロジーと位置づけられています。本講座では、ハイブリッド接合技術の最前線の研究開発動向と今後の課題…

9月5日(金)13:00-17:00に、神奈川県立産業技術総合研究所 #KISTEC が講座『半導体チップレット集積とハイブリッド接合技術の研究動向と課題』を開催。川崎市高津区・かながわサイエンスパーク(KSP)にて。案内は bit.ly/45ZmSZ0 に、リーフレット(PDF)は bit.ly/4lfswe1 に。
#Course #Chiplet #HybridBonding

Electrifying Everything: Power Moves Toward ICs Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.

Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.
semiengineering.com/electrifying...
#semiconductor #WBG #advancedpackaging #GaN #SiC #hybridbonding

A nice overview! Supply Chain HBM.
#HBM #hybridbonding #Besi #semiconductors #ASML #samsung #TSMC

Hybrid Bonding Makes Strides Toward Manufacturability Companies are selecting preferred flows, but the process details are changing rapidly to meet the needs of different applications.

Hybrid bonding is gaining traction in advanced packaging because it offers the shortest vertical connection between dies of similar or different functionalities, as well as better thermal, electrical and reliability results.

semiengineering.com/hybrid-bondi...

#semiconductor #hybridbonding